JPH0468547U - - Google Patents
Info
- Publication number
- JPH0468547U JPH0468547U JP1990111623U JP11162390U JPH0468547U JP H0468547 U JPH0468547 U JP H0468547U JP 1990111623 U JP1990111623 U JP 1990111623U JP 11162390 U JP11162390 U JP 11162390U JP H0468547 U JPH0468547 U JP H0468547U
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- integrated circuit
- cooling pipe
- circuit element
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 12
- 239000000498 cooling water Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990111623U JPH0468547U (en]) | 1990-10-26 | 1990-10-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990111623U JPH0468547U (en]) | 1990-10-26 | 1990-10-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0468547U true JPH0468547U (en]) | 1992-06-17 |
Family
ID=31859091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990111623U Pending JPH0468547U (en]) | 1990-10-26 | 1990-10-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0468547U (en]) |
-
1990
- 1990-10-26 JP JP1990111623U patent/JPH0468547U/ja active Pending